Sign In | Join Free | My ccnmag.com
China Dongguan Ziitek Electronic Materials & Technology Ltd. logo
Dongguan Ziitek Electronic Materials & Technology Ltd.
Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer
Verified Supplier

10 Years

Home > Thermal Gap Filler >

Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad

Dongguan Ziitek Electronic Materials & Technology Ltd.
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad

  • 1
  • 2

Brand Name : ZIITEK

Model Number : TS-TIF100C 8045-11

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 10000/day

Delivery Time : 3-5work days

Packaging Details : 1000pcs/bag

Products name : Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad

Keywords : Thermal Conductive Silicone Pad

Hardness : 45 Shore 00

Color : Gray

Specific Gravity : 3.4g/cc

Thickness : 0.012"(0.30mm)~0.200"(5.00mm)

Construction : Ceramic filled silicone elastomer

Continuos Use Temp : -45℃ to 200℃

Thermal conductivity& Compostion : 8.0W/m-K

Application : GPU Laptop

Contact Now

Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad

TS-TIF®100C 8045-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures,thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.


Features:
> Excellent thermal conductivity 8.0W/mK

> Moldability for complex parts
> Soft and compressible for low stress applications
> Broad range of hardnesses available
> BMoldability for complex parts
> BOutstanding thermal performance


Applications:

> Telecommunication hardware
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units

> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

> Display card
> Mainboard/mother board
> Notebook
> Power supply

Typical Properties of TS-TIF®100C 8045-11 Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.4g/cc ASTM D297
thickness 0.012"(0.30mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness<1.0mm) 45 (Shore 00) ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 7.2MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 8.0W/m-K ASTM D5470

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Product Specification
Product Thicknesses: 0.012"(0.30mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.
Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad
Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.


Product Tags:

High Temperature Thermal Conductive Silicone Pad

      

Laptop Thermal Conductive Silicone Pad

      

High-Temperature Insulation Gap Pad

      
China Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad wholesale

Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Dongguan Ziitek Electronic Materials & Technology Ltd.
*Subject:
*Message:
Characters Remaining: (0/3000)