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Used Between Transistors And Heat Sinks High Reliability Thermal Graphite Pad Thermal Graphite Sheet

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Used Between Transistors And Heat Sinks High Reliability Thermal Graphite Pad Thermal Graphite Sheet

Name: Used Between Transistors And Heat Sinks High Reliability Thermal Graphite Pad Thermal Graphite Sheet
Brand: Ziitek
Price: 0.1 USD

China Used Between Transistors And Heat Sinks High Reliability Thermal Graphite Pad Thermal Graphite Sheet wholesale

Brand Name : Ziitek

Model Number : TS-TIR300L-A1

Certification : RoHs

Place of Origin : China

MOQ : 1000PCS

Price : 0.1-10 USD/PCS

Supply Ability : 100000pcs/day

Delivery Time : 2-3 work days

Packaging Details : 1000pcs/bag

Product name : Used Between Transistors And Heat Sinks High Reliability Thermal Graphite Pad Thermal Graphite Sheet

Thickness : 0.15mm

Density : 1.4 g/cc

Thermal conductivity (Z Axis Direction) : 2.5W/m-K

Hardness : 90 Shore A

Application : Between Heat Sinks And External casings

Color : Black

Keywords : Thermal Graphite Sheet

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Used Between Transistors And Heat Sinks High Reliability Thermal Graphite Pad Thermal Graphite Sheet

TIR^®300L-A1 Series is a graphite-enhanced composite thermal interface material engineered forhigh thermal conductivity and reliable heat dissipation.Reinforced with an aluminum foil layer,it maintains structural integrity throughout handling and application. The material conforms well to a variety of surfaces, enabling efficient thermal contact and ease of assembly. lt is ideally suited for use between power transistors and heat sinks, as well as in large-areathermal interface applications.

Feature

> Excellent thermal impedance
> Replaces traditional thermal grease

> High reliability
> Easy to apply to surfaces

Application

> Between transistors and heat sinks

> Between mechanical structures

> Between heat sinks and externalcasings

Typical Properties of TIR^®300L-A1 series
Product Name	TIR^®300L-A1	Test Method
Colour	Black	Visual
Reinforcement Carrier	Aluminum	*****
Thickness range	0.15 mm	ASTM D374
Hardness	90 Shore 00	ASTM D2240
Density	1.4g/cc	ASTM D792
Volume Resistivity(ohm-cm)	1*10²	ASTM D257
Continuous Use Temperature	-60℃~ 180℃	Ziitek Test Method
Thermal Conductivity(W/mK)	2.5	ASTM D5470
Thermal impedance(℃-in²/W)@30psi	0.3	ASTM D5470
Thermal impedance(℃-in²/W)@50psi	0.25	ASTM D5470
180° Peel Strength	1.0N/25mm	ASTM D3330 (Steel,Immediate)

Used Between Transistors And Heat Sinks High Reliability Thermal Graphite Pad Thermal Graphite Sheet

Packaging Details & Lead time

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

Product Tags:

Transistors Thermal Graphite Pad

Heat Sinks Thermal Graphite Pad

Used Between Transistors And Heat Sinks High Reliability Thermal Graphite Pad Thermal Graphite Sheet Images

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