1.0mmT silicone pad 20 Shore00 for RDRAM memory modules ,Good thermal conductive:1.8W / MK
The TIF540-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
TIF500-18-11US Datasheet-REV02.pdf
Features:
> Good thermal conductive: 1.8W/mK
>Thickness:1.0mmT
>Broad range of hardnesses available
>Fiberglass reinforced for puncture, shear and tear resistance
>Easy release construction
>Moldability for complex parts
>Outstanding thermal performance
Applications:
>RDRAM memory modules
>Micro heat pipe thermal solutions
>Automotive engine control units
>Heat pipe thermal solutions
>Memory Modules
>Mass storage devices
>LED Controller
>LED Ceilinglamp
>Monitoring the Power Box
| Typical Properties of TIF™540-18-11US |
| Color | Grey | Visual | Composite Thickness | hermalImpedance
@10psi
(℃-in²/W) |
Construction &
Compostion | Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.21 |
| 20mils / 0.508 mm | 0.27 |
| Specific Gravity | 2.8 g /cc | ASTM D297 | 30mils / 0.762 mm | 0.39 |
| 40mils / 1.016 mm | 0.43 |
| Heat Capacity | 1 l /g-K | ASTM C351 | 50mils / 1.270 mm | 0.50 |
| 60mils / 1.524 mm | 0.58 |
| Hardness | 20 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.65 |
| 80mils / 2.032 mm | 0.76 |
| Thickness
| 1.0mmT | *** | 90mils / 2.286 mm | 0.85 |
| 100mils / 2.540 mm | 0.94 |
| Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 1.00 |
| 120mils / 3.048 mm | 1.07 |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.16 |
| 140mils / 3.556 mm | 1.25 |
| Dielectric Constant | 4.2 MHz | ASTM D150 | 150mils / 3.810 mm | 1.31 |
| 160mils / 4.064 mm | 1.38 |
| Volume Resistivity | 1.0X1012 Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 1.43 |
| 180mils / 4.572 mm | 1.50 |
| Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.60 |
| 200mils / 5.080 mm | 1.72 |
| Thermal conductivity | 1.8 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
FAQ
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a g
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1.0mmT Silicone Pad 20 Shore00 For RDRAM Memory Modules 1.8W / MK Images
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